As electronic products such as computers, tablets, and smartphones become smaller and more advanced, the semiconductor industry is increasingly required to deliver higher quality and more compact components. Equipment designs are becoming more precise, and particles that were once considered insignificant have now become a critical issue that must be addressed.

Semiconductor manufacturing equipment is extremely expensive, and unexpected downtime can lead to reduced production output and significant financial losses. In particular, when particles accumulate on pin chucks or electrostatic chucks, they may cause system errors or equipment shutdowns.

Typically, cleaning wafers (dummy wafers) are used to remove particles. However, some particles cannot be removed by dummy wafers, requiring the equipment to be stopped for manual cleaning, which often results in extended downtime before the equipment can resume operation.

To address this issue, we developed the “eRaser Disk” specifically for semiconductor manufacturing equipment. Designed in the shape of a wafer, it features a special coating on its surface that removes particles from the chuck surface upon contact. This helps reduce dummy wafer operation time and minimize equipment downtime.