Ion Pad uses a special resin as its base material. Through the contact surface between the Ion Pad and the object, chemical and physical bonding occurs, allowing the object to be securely held in place. This interfacial interaction enables adhesion without the need for electricity, vacuum, or other external mechanisms.

Since no electrical wiring or piping is required, Ion Pad helps simplify equipment design while being environmentally friendly.

Ion Pad can be used to hold and transport relatively flat products, such as thin glass and warped wafers. It can also be applied to robotic arms for high-speed handling, providing anti-slip performance to prevent wafers or products from flying off or slipping during movement.